Seiko Seiki SIG 04

SEE MORE SPEX

Seiko Seiki | Grinding

Seiko Seiki | Grinding

Seiko Seiki | Grinding

Seiko Seiki | Grinding

Imperial

Metric

Workpiece Envelope
Grinding Length:	3.150" 80.010mm
Grinding Depth:	1.970" 50.000mm
Grinding Width:	1.970" 50.010mm
ID Min Grinding Diameter(s):	0.040" 1.000mm
ID Max Grinding Diameter(s):	2.760" 70.000mm
ID Max Grinding Diameter(s) Opt:	3.940" 100.000mm

Grinding Wheel And Spindle

Grinding Wheel:

Grinding Wheel Width:	0.000" 0.000mm

Wheel Head:

Workhead:

RPM:	4,000

Axes Specifications
Longitudinal:	7.090" 180.000mm
Cross:	1.580" 40.000mm